 | |
| Besi | |
| Company type | Public |
| |
| ISIN | NL0012866412 |
| Industry | Semiconductors |
| Founded | 1995 |
| Founders | Richard Blickman (CEO since 1995) |
| Headquarters | Duiven , The Netherlands |
Area served | Worldwide |
| Revenue | €592.8 million (2017) |
Number of employees | 1819 (2022) |
| Website | https://besi.com |
BE Semiconductor Industries N.V., simply called Besi, is a Dutch multinational company that designs and manufacturers semiconductor equipment. [1] [2] Besi offers die attach, packaging, and plating solutions.
History
The company was founded in May, 1995 by Richard Blickman, who still leads the company today. At the end of 2022, Besi had a total of 1,675 permanent and 144 temporary employees. [3] It outsources production to its subsidiaries in China and Malaysia.
Besi is a publicly traded company, and its shares are listed on the Euronext Amsterdam stock market under the BESI ticker symbol. [4] [5] In 2021, Besi was valued at around $5.6 billion. [5]
Products
Besi offers die attach, packaging and plating solutions, with the die attach segment making up 82 % of the revenue in 2021. [6] The segment includes Flip Chip, Hybrid Bonding as well as Thermo Compression products among others. [7] [8] [9] In total, Besi had a 42 % market share in the segment in 2022, making them the market leader. [10] The company's plating products on the other hand are used mainly for solar cells and connectors, as well as other electric devices. [11]
References
- ^ "BESI.AS - | Stock Price & Latest News | Reuters". www.reuters.com. Retrieved 2023-09-10.
- ^ "BESI:EN Amsterdam Stock Quote - BE Semiconductor Industries NV". Bloomberg.com. Retrieved 2017-06-15.
- ^ "Company Profile". Besi. Retrieved 2023-09-12.
- ^ "BE Semiconductor Industries NV: AMS:BESI quotes & news - Google Finance". www.google.com. Retrieved 2017-06-15.
- ^ a b "BE SEMICONDUCTOR | Euronext". www.euronext.com (in Dutch). Retrieved 2019-03-15.
- ^ "Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems" (PDF). inemi.org. Retrieved 2023-12-13.
- ^ "Advanced Packaging Part 3 – Intel's Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape". semianalysis.com. 2022-01-19. Retrieved 2023-12-13.
- ^ "Products & Technology". besi.com. Retrieved 2023-12-13.
- ^ "Besi holds the best cards in advanced packaging, but the game has only just begun". bits-chips.nl. 2023-11-01. Retrieved 2023-12-13.
- ^ "One Under-the-Radar Semiconductor Stock With 125% Upside, According to Wall Street". fool.com. 2022-10-24. Retrieved 2023-12-13.
- ^ "New Contact Plating Processes Cut Costs, Improve Environmental Impacts". connectorsupplier.com. 2022-03-01. Retrieved 2023-12-13.
